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W25Q16BV 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: July 08, 2010 Revision F W25Q16BV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES....................................................................................................................................... 5 3. PIN CONFIGURATION SOIC 150 / 208-MIL ................................................................................... 6 4. PAD CONFIGURATION WSON 6X5-MM ........................................................................................ 6 5. PAD CONFIGURATION PDIP 300-MIL ........................................................................................... 7 6. PIN DESCRIPTION SOIC 150/208-MIL, PDIP 300-MIL AND WSON 6X5-MM............................... 7 7. PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 8 8. PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 8 8.1 Package Types..................................................................................................................... 9 8.2 Chip Select (/CS).................................................................................................................. 9 8.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 8.4 Write Protect (/WP)............................................................................................................... 9 8.5 HOLD (/HOLD) ..................................................................................................................... 9 8.6 Serial Clock (CLK) ................................................................................................................ 9 9. BLOCK DIAGRAM.......................................................................................................................... 10 10. FUNCTIONAL DESCRIPTION ....................................................................................................... 11 10.1 10.2 SPI OPERATIONS ............................................................................................................. 11 10.1.1 Standard SPI Instructions...................................................................................................11 10.1.2 Dual SPI Instructions ..........................................................................................................11 10.1.3 Quad SPI Instructions.........................................................................................................11 10.1.4 Hold Function .....................................................................................................................11 WRITE PROTECTION ....................................................................................................... 12 10.2.1 11. Write Protect Features........................................................................................................12 CONTROL AND STATUS REGISTERS ........................................................................................ 13 11.1 11.2 STATUS REGISTER .......................................................................................................... 13 11.1.1 BUSY..................................................................................................................................13 11.1.2 Write Enable Latch (WEL) ..................................................................................................13 11.1.3 Block Protect Bits (BP2, BP1, BP0)....................................................................................13 11.1.4 Top/Bottom Block Protect (TB)...........................................................................................13 11.1.5 Sector/Block Protect (SEC) ................................................................................................13 11.1.6 Status Register Protect (SRP1, SRP0)...............................................................................14 11.1.7 Erase Suspend Status (SUS) .............................................................................................14 11.1.8 Quad Enable (QE) ..............................................................................................................14 11.1.9 Status Register Memory Protection ....................................................................................16 INSTRUCTIONS................................................................................................................. 17 11.2.1 Manufacturer and Device Identification ..............................................................................17 -2- W25Q16BV 12. 11.2.2 Instruction Set Table 1 (Erase, Program Instructions) ........................................................18 11.2.3 Instruction Set Table 2 (Read Instructions) ........................................................................19 11.2.4 Instruction Set Table 3 (ID, Security Instructions)...............................................................20 11.2.5 Write Enable (06h)..............................................................................................................21 11.2.6 Write Disable (04h).............................................................................................................21 11.2.7 Read Status Register-1 (05h) and Read Status Register-2 (35h).......................................22 11.2.8 Write Status Register (01h) ................................................................................................23 11.2.9 Read Data (03h) .................................................................................................................24 11.2.10 Fast Read (0Bh) ...............................................................................................................25 11.2.11 Fast Read Dual Output (3Bh) ...........................................................................................26 11.2.12 Fast Read Quad Output (6Bh)..........................................................................................27 11.2.13 Fast Read Dual I/O (BBh).................................................................................................28 11.2.14 Fast Read Quad I/O (EBh) ...............................................................................................30 11.2.15 Word Read Quad I/O (E7h) ..............................................................................................32 11.2.16 Octal Word Read Quad I/O (E3h).....................................................................................34 11.2.17 Page Program (02h) .........................................................................................................36 11.2.18 Quad Input Page Program (32h) ......................................................................................37 11.2.19 Sector Erase (20h) ...........................................................................................................38 11.2.20 32KB Block Erase (52h) ...................................................................................................39 11.2.21 64KB Block Erase (D8h)...................................................................................................40 11.2.22 Chip Erase (C7h / 60h).....................................................................................................41 11.2.23 Erase Suspend (75h)........................................................................................................42 11.2.24 Erase Resume (7Ah) ........................................................................................................43 11.2.25 Power-down (B9h) ............................................................................................................44 11.2.26 Release Power-down / Device ID (ABh) ...........................................................................45 11.2.27 Read Manufacturer / Device ID (90h) ...............................................................................47 11.2.28 Read Manufacturer / Device ID Dual I/O (92h) .................................................................48 11.2.29 Read Manufacturer / Device ID Quad I/O (94h)................................................................49 11.2.30 Read Unique ID Number (4Bh).........................................................................................50 11.2.31 Read JEDEC ID (9Fh) ......................................................................................................51 11.2.32 Continuous Read Mode Reset (FFh or FFFFh) ................................................................52 ELECTRICAL CHARACTERISTICS .............................................................................................. 53 12.1 Absolute Maximum Ratings................................................................................................ 53 12.2 Operating Ranges .............................................................................................................. 53 12.3 Power-up Timing and Write Inhibit Threshold .................................................................... 54 12.4 DC Electrical Characteristics.............................................................................................. 55 12.5 AC Measurement Conditions ............................................................................................. 56 12.6 AC Electrical Characteristics .............................................................................................. 57 12.7 AC Electrical Characteristics (cont’d)................................................................................. 58 -3- Publication Release Date: July 08, 2010 Revision F W25Q16BV 13. 14. 12.8 Serial Output Timing........................................................................................................... 59 12.9 Serial Input Timing.............................................................................................................. 59 12.10 Hold Timing ....................................................................................................................... 59 PACKAGE SPECIFICATION.......................................................................................................... 60 13.1 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 60 13.2 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 61 13.3 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 62 13.4 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 63 13.5 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 65 ORDERING INFORMATION .......................................................................................................... 66 14.1 15. Valid Part Numbers and Top Side Marking........................................................................ 67 REVISION HISTORY...................................................................................................................... 68 -4- W25Q16BV 1. GENERAL DESCRIPTION The W25Q16BV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages. The W25Q16BV array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16BV has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q16BV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz for Dual Output and 416MHz for Quad Output when using the Fast Read Dual/Quad Output instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W25Q16BV: 16M-bit / 2M-byte (2,097,152) – 256-bytes per programmable page • Standard, Dual or Quad SPI – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – Up to 8X that of ordinary Serial Flash – 104MHz clock operation – 208MHz equivalent Dual SPI – 416MHz equivalent Quad SPI – 50MB/S continuous data transfer rate • Efficient “Continuous Read Mode” – Low Instruction overhead – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash Notes • Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,